TWR-MPC8309【PDF 1/81 页】TOWER SYSTEM MODULE MPC8309

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Freescale Semiconductor

Technical Data

Document Number:MPC8309EC

Rev. 3, 04/2014

MPC8309

PowerQUICC II Pro Integrated

Communications Processor

Family Hardware Specifications

This document provides an overview of the MPC 8309

Contents

PowerQUICC II Pro processor features. The MPC8309 is a

cost-effective, highly integrated communications processor

that addresses the requirements of several networking

applications including residential gateways, modem/routers,

industrial control, and test and measurement applications.

The MPC8309 extends current PowerQUICC offerings,

adding higher CPU performance, additional functionality,

and faster interfaces, while addressing the requirements

related to time-to-market, price, power consumption, and

board real estate. This document describes the electrical

characteristics of MPC8309.

To locate published errata or updates for this document, refer

to the MPC8309 product summary page on our website

listed on the back cover of this document or contact your

local Freescale sales office.

? 2011, 2012, 2014 Freescale Semiconductor, Inc. All rights reserved.

Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . 7

Power characteristics . . . . . . . . . . . . . . . . . . . . . . . . 11

Clock input timing . . . . . . . . . . . . . . . . . . . . . . . . . . 12

RESET initialization . . . . . . . . . . . . . . . . . . . . . . . . . 13

DDR2 SDRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Enhanced local bus . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Ethernet and MII management . . . . . . . . . . . . . . . . . 22

TDM/SI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

HDLC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

PCI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

USB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

DUART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

eSDHC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

FlexCAN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

I 2 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

GPIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

IPIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

Package and pin listings . . . . . . . . . . . . . . . . . . . . . . 52

Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65

Thermal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72

System design information . . . . . . . . . . . . . . . . . . . . 75

Ordering information . . . . . . . . . . . . . . . . . . . . . . . . 78

Document revision history . . . . . . . . . . . . . . . . . . . . 80

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